Ansys Product Release
& Updates
Ansys Product
Release & Updates
The new Ansys 2025 R1 version is now available!
Ansys, Inc. introduced the new Ansys 2025 R1 release on February 4, 2025. You’ll find new features and developments in all areas of Ansys software application.
The new Ansys 2025 R1 version is now available!
Ansys, Inc. introduced the new Ansys 2025 R1 release on February 4, 2025. You’ll find new features and developments in all areas of Ansys software application.

Ansys Structures
The 2025 R1 release of Ansys Structures introduces a suite of new features designed to provide holistic advantages to our customers, categorized by product. Ansys Mechanical delivers powerful enhancements in solver capabilities, comprehensive integration for NVH (Noise, Vibration, and Harshness) applications, and advanced tools for material and crack growth analysis.
These upgrades empower engineers to handle large, demanding models with improved accuracy, efficiency, and reliability across various industries. Ansys LS-DYNA offers new solvers and methods that accurately describe real-world applications, from gas flows to adhesives and batteries. Ansys Sherlock provides new features centered around Thermal-Mech life predictions for BGA packages, in addition to PySherlock updates with new APIs and the automation of specific workflows.

Ansys Fluids
Ansys Fluids 2025 R1 continues to deliver critical enhancements to meet our customers’ performance and productivity needs. The Fluent GPU solver now supports additional physics, including the FGM combustion model, particle and droplet modeling with the discrete phase model (DPM), surface-to-surface radiation, and more. Finally, advancements across Thermal Desktop, Rocky, and CFX include dramatic performance improvements, new multi-physics integrations, and additional optimization options

Ansys Electronics
Accelerate your time-to-market and drive innovation with new capabilities that boost simulation speed and accuracy while enhancing user experience. The axial-flux machine template enhances meshing accuracy and speed for electric machines. Improved TZR speed import and workflows simplify 3D-IC modeling. Experience a faster A-Phi Eddy current solver for DC-biased frequency domain analysis tailored for power electronics. Enjoy more flexible and accurate system-level simulations, quicker IC design evaluations, streamlined PI analysis workflows, and AI/ML-driven time and memory predictions that optimize performance

Ansys 3D Design
Ansys Discovery 2025 R1 introduces powerful new features, enhancing the entire design exploration and simulation workflow. Model preparation is more efficient with features like detecting sweep meshing feasibility and creating custom beams. Accelerate complex electronics cooling simulations with GPU-based automated meshing and expanded electromagnetic capabilities. Finally, take design exploration to new levels and investigate more designs in less time and effort with the ability to burst to cloud and solve thousands of simulations in minutes.

Ansys Digital Twin
Ansys 2025 R1 enhances its digital twin capabilities with hybrid analytics, scaled deployment, and new features for improved flexibility and usability. Key updates include the Ansys Unified Installer, a scriptable Python interface for Reduced Order Models (ROMs), and enhancements to hybrid analytics post-processing. Ansys TwinAI™ now supports SysML v2 snippet export, menu-based help, expanded file export options, and new examples for PyAEDT and PyTwin to streamline development.

Ansys Additive
We are excited to announce the integration of Ansys’ advanced simulation technology into Materialise Magics, a strategic partnership poised to transform metal additive manufacturing. This collaboration enhances product quality, reduces costs, and drives innovation by mitigating risks, and predicting and addressing part deformation and thermal stress early.

Ansys Semiconductors
The 2025 R1 release considerably speeds-up almost every semiconductor product, while PowerArtist™ introduces a powerful new methodology for analyzing and fixing glitch power. PowerX™ is a new software product for parasitic debugging of semiconductor power devices, and RedHawk-SC Security™ has partnered with eShard™ to expand side-channel security analytics. RedHawk-SC Electrothermal™ has collaborated with TSMC™ to develop a flow for evaluating thermal manufacturing stresses in 3D-ICs.

Ansys Embedded Software
Continuing the momentum from our last release, Ansys Embedded Software 2025 R1 release takes the innovations one step further. Keeping software safety certification for customers as a primary objective, the new release of Ansys SCADE contains notable improvements for certified/qualified code generation for DO178C and ISO 26262 safety standards and continues to be leader in certification/qualification for automotive and aerospace industries. Scade One latest release delivers a complete workflow for test and introduces PyScadeOne.

Ansys Safety Analysis
2025 R1 brings new UX and UI features across the Ansys Safety Analysis product collection to offer an improved way of working and new levels of efficiency. As safety projects become more complex, our solutions aim to evolve with customers’ needs. Our model-based safety solution enables users to perform FMEAs faster and more effectively with smarter navigation in the tool, allowing them to quickly update the analysis even as their hardware evolves.
The Digital Safety Manager (DSM) platform now offers customer-defined safety KPIs, fed by live-reported Ansys medini data, to bridge the gap between safety engineer and manager. Make your safety analysis a visible part of the product development process.

Ansys Materials
Ansys Granta 2025 R1 introduces many new features and enhancements, bringing a unified experience for Ansys Granta MI users across CAD, CAE, and PLM platforms. It also includes significant improvements for search and introduces new material data in polymers, electromagnetics, and sustainability within the material libraries, helping engineers and designers be more productive without leaving their preferred engineering tools.

Ansys Optics
Ansys Optics has released its 2025 R1 release, focusing on unified multiphysics analysis, streamlined workflows, and improved user experiences. Key updates include stress birefringence in STAR, design for manufacturing – mechanical pivot points (MPVT), Pervasive Insights – Dark Theme, X-Rite AxF support, Python-based API, advanced optical lens design for headlamps, multi-GPU performance and meshing enhancements, and a modern user interface for Lumerical FDTD. These updates aim to improve simulations, accuracy, and collaboration, and solidifying Ansys Optics as a leader in optical simulation and design. The updated software is available on GitHub for easy adoption into simulation pipelines and bespoke GUI development.

Autonomous Vehicle Simulation
Ansys AV simulation for 2025 R1 enhances autonomous systems’ safety, efficiency, and usability. Key features include accurate 3D sensor placement, IP protection for camera imagers, and standardized interconnects for radar sensor interface. Improved interoperability and connectivity with AVxcelerate Autonomy ensures seamless integration and improved adaptability, driving the autonomous industry forward with robust, secure solutions that meet high safety standards and enhance performance and user experience.

Ansys Connect
This release enhances the digital engineering enablers with Materials (Granta) and Simulation (Minerva) data now more readily integrated with CAD, CAE and PLM with an enhanced UX to improve search and export. Enable next generation MBSE with the extended SysML v2 support and model management in the Ansys System Architecture Modeler with deeper integration with Ansys ModelCenter. Ansys optiSLang™ expands its capabilities with new distributed computing options and advanced Algorithms adding flexibility and performance to a customer’s engineering workflow.

Digital Missions Engineering
Ansys Digital Mission Engineering introduces several notable updates and enhancements for 2025 R1, empowering users to tackle various mission design challenges. These key updates enhance mission design and analysis capabilities, RF modeling, and systems engineering integration to support better the growing complexity and scope of modern aerospace and defense system development.