Electromagnetics
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The gold standard for electormagnetic field simulation
ANSYS electromagnetic field simulation helps you design innovative electrical and electronic products faster and more cost-effectively. In today’s world of high performance electronics and advanced electrification systems, the effects of electromagnetic fields on circuits and systems cannot be ignored.
ANSYS software can uniquely simulate electromagnetic performance across component, circuit and system design, and can evaluate temperature, vibration and other critical mechanical effects. This unmatched electromagnetic-centric design flow helps you achieve first-pass system design success for advanced communication systems, high-speed electronic devices, electromechanical components and power electronics systems.
Features
The Internet of Things, wearable electronics, 5G, unmanned aerial vehicles (UAV) and automotive radar are emerging applications that are driving extreme integration of RF and wireless communications. The ANSYS Antenna and Wireless System design flow delivers the simulation features you need to create reliable, optimized systems faster than your competition.
Analyze complex automotive radar driving scenarios using the powerful and accurate methods of ANSYS HFSS SBR+. Engineers can solve advanced automotive ADAS radar systems and understand the response from a complex automotive driving scenario. Features include SBR+ solution type, parametric antenna sources with far-field overlay and accelerated frequency sweeps.
ANSYS HFSS-SBR+ is a powerful, shooting and bouncing ray (SBR) electromagnetic field solver option for HFSS. HFSS SBR+ predicts performance of antennas mounted to electrically large platforms. Antenna designs created in HFSS can be linked to HFSS SBR+ and placed on an electrically large platform and rapidly solved. This powerful combination enables you to analyze installed performance and optimize antenna placement.
With a rapidly increasing number of wireless devices and a finite spectrum in which to operate, the likelihood of these communication systems interfering with each other and degrading the performance of neighboring systems becomes greater every day. The ANSYS RF Option now includes EMIT, the industry-leading software for predicting RF co-site and EMI interference of multiple radio transmitters and receivers.
As communication systems push the limits of component size, weight and performance, engineers must adopt new technologies and smarter workflows by leveraging EM field simulators linked to powerful harmonic balance and transient circuit simulation. ANSYS electromagnetic solutions break the cycle of repeated design iterations and physical prototyping. With ANSYS solutions, you can consistently achieve best-in-class design in a broad range of applications including passive RF/mW components, integrated multichip modules, advanced packaging and RF PCBs.
ANSYS provides a complete suite of engineering simulation tools to help identify signal integrity issues early in the design cycle for electronics IC packages, PCBs, connectors and other complex interconnects. ANSYS signal integrity analysis products predict EMI/EMC, signal integrity and power integrity issues — enabling your design team to optimize system performance before build and test.
ANSYS provides the world’s leading simulation solution for power delivery from chip to package, PCBs and chassis/casings. ANSYS simulation tools for multifoundry-certified chip-level power sign-off, automated AC operating performance prediction and DC power loss and thermal mitigation ensure chip-package-system power integrity for performance, reliability and cost.
Sensors, actuators, and transformers and other electromagnetic and electromechanical devices are key to the megatrend of electrification. ANSYS low frequency, electromagnetic field simulation software allows you to accurately calculate critical design parameters and automatically create precise system-level device models quickly and accurately.
ANSYS provides electronics cooling simulation products for chip, package and board thermal analysis as well as thermo-mechanical stress analysis. ANSYS simulation tools help you manage excessive heat that can otherwise lead to increasing leakage and electromigration failures of the chip, as well as analyze die package, PCB and interconnect thermal differential expansion to enhance reliability of the entire electronic system.
ANSYS delivers a comprehensive motor design methodology that will reduce design cost and optimize size, noise, efficiency and durability. The ANSYS motor design solution delivers robust electromagnetic, thermal and mechanical analyses, combined with power electronic circuit simulation and embedded software tools to analyze the complete motor-driven system.
From electric drives to power supplies and robotic systems, ANSYS is the choice for power electronics designers worldwide. With ANSYS power electronics design solutions, you can achieve first-pass system success and deliver efficient, optimized designs in less time and with less cost.
Model the radar signatures of electrically very large targets and scenes with the powerful HFSS SBR+ solver. Engineers can easily perform fast radar cross section (RCS) calculations to detect objects such as aircrafts, vehicles and ships, as well as design these objects to minimize radar detection.
Low frequency: improving the efficiency of an electric motor
High frequency: propagation of an EM wave from an antenna.
Source: PIDSO
Features
ANSYS offers a comprehensive and expandable library of material models for nonlinear, anisotropic and temperature-dependent material behavior as well as for 3D vector hysteresis. In addition, integrated adaptive networking methods ensure robust results for static and dynamic analyses (Maxwell, HFSS). In addition, the user-friendly characterization of motion effects in electromagnetic field tasks (rotation, translation, oscillation). The functionality is rounded off by a comprehensive application-optimized element technology (such as mixed finite and boundary elements) and a fast equation solution in 2D and 3D. Parallel and simultaneous computing also enables High Performance Computing (HPC).
Predefined sequences, for example for rotating electrical machines (RMxprt), power electronics (PExprt) or antennas (Antenna Design Kit), save time and ensure maximum accuracy.
You can tailor the CAE system even more specifically to your requirements by making your own adjustments. Several language standards are available for this purpose: VHDL-AMS, Modelica and Python. You also have a free choice of potential formulations - for maximum accuracy and the best possible performance, especially in parameter studies. In addition, the embedded calculator allows flexible access to all important integral results.
Matrix and solver couplings enable the linking of different physical domains. The integrated and automatable derivation of behavior models for system simulations as well as the co-simulation with the circuit simulator ANSYS Simplorer and the fluid solution ANSYS CFD are added.
ANSYS Modules
The following modules, some of which are specialized, are available for the multitude of demanding simulation tasks in the field of electromagnetism:
Electronics Desktop is the premier, unified platform for electromagnetic, circuit and system simulation. HFSS, Maxwell, Q3D Extractor and Simplorer are built into the Electronics Desktop, which serves as a universal pre and post processor for these tools.
Maxwell is a comprehensive electromagnetic field simulation software for the design of motors, actuators, transformers and other electrical and electromechanical devices. Maxwell can solve static, frequency-domain and time-varying electromagnetic and electric fields.
HFSS simulates 3-D full-wave electromagnetic fields for accurate design of high-frequency and high-speed electronic components. HFSS offers powerful solver technologies based on finite element, integral equation, asymptotic and advanced hybrid methods to solve microwave, RF and high-speed digital challenges.
Icepak provides CFD simulation for electronics thermal management designs. Icepak predicts airflow, temperature and heat transfer in IC packages, printed circuit boards, electronic assemblies/enclosures, power electronics and more.
SIwave is a specialized design platform for power integrity, signal integrity and EMI analysis of electronic packages and PCBs.
Q3D Extractor provides 2-D and 3-D parasitic extraction for engineers designing electronic packaging and power electronic equipment.
